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preliminary data this is preliminary information on a new product now in deve lopment or undergoing evaluation. details are subject to change without notice. april 2009 doc id 15606 rev 1 1/13 13 STB200N6F3, sti200n6f3 stp200n6f3 n-channel 60 v, 3 m ? , 120 a d 2 pak, to-220, i 2 pa k stripfet? power mosfet features ultra low on-resistance 100% avalanche tested application switching applications description this stripfet? iii power mosfet technology is among the latest improvements, which have been especially tailored to minimize on-state resistance providing superior switching performance. figure 1. internal schematic diagram type v dss r ds(on) i d pw STB200N6F3 60 v < 3.6 m ? 120 a (1) 1. value limited by wire bonding 330 w sti200n6f3 60 v < 3.9 m ? 120 a (1) 330 w stp200n6f3 60 v < 3.9 m ? 120 a (1) 330 w d 2 pak 1 3 to-220 1 2 3 1 2 3 i 2 pak table 1. device summary order codes marking package packaging STB200N6F3 200n6f3 d 2 pak tape & reel sti200n6f3 200n6f3 i 2 pa k tu b e stp200n6f3 200n6f3 to-220 tube www.st.com
contents STB200N6F3, sti200n6f3, stp200n6f3 2/13 doc id 15606 rev 1 contents 1 electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5 packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
STB200N6F3, sti200 n6f3, stp200n6f3 electrical ratings doc id 15606 rev 1 3/13 1 electrical ratings table 2. absolute maximum ratings symbol parameter value unit v ds drain-source voltage (v gs =0) 60 v v gs gate-source voltage 20 v i d (1) 1. current limited by package. drain current (continuous) at t c = 25c 120 a i d (1) drain current (continuous) at t c =100c 120 a i dm (2) 2. pulse width limited by safe operating area. drain current (pulsed) 480 a p tot total dissipation at t c = 25c 330 w derating factor 2.2 w/c dv/dt (3) 3. i sd 120 a, di/dt tbd, v dd v (br)dss , t j t jmax peak diode recovery voltage slope tbd v/ns e as (4) 4. starting tj = 25 c, i d = tbd, v dd = tbd (see figure 5 and figure 6) single pulse avalanche energy tbd mj t j t stg operating junction temperature storage temperature -55 to 175 c table 3. thermal data symbol parameter to-220/i2pak d2pak unit rthj-case thermal resistance junction-case 0.45 c/w rthj-a thermal resistance junction-ambient max 62.5 c/w rthj-pcb (1) 1. when mounted on 1 inch2 fr4 2oz cu. thermal resistance junction-ambient max 50 c/w t l maximum lead temperature for soldering purpose 300 c
electrical characteristics STB200N6F3, sti200n6f3, stp200n6f3 4/13 doc id 15606 rev 1 2 electrical characteristics (t case =25 c unless otherwise specified) table 4. on/off states symbol parameter test conditions min. typ. max. unit v (br)dss drain-source breakdown voltage i d = 250 a, v gs = 0 60 v i dss zero gate voltage drain current (v gs = 0) v ds = max rating, v ds = max rating,@125c 10 100 a a i gss gate body leakage current (v ds = 0) v gs = 20 v 200 na v gs(th) gate threshold voltage v ds = v gs , i d = 250 a 2 4 v r ds(on) static drain-source on resistance v gs = 10 v, i d = 60 a d2pak to-220, i2pak 3 3.3 3.6 3.9 m ? m ? table 5. dynamic symbol parameter test conditions min. typ. max. unit c iss c oss c rss input capacitance output capacitance reverse transfer capacitance v ds = 25 v, f = 1mhz, v gs = 0 - 6800 1450 15 - pf pf pf t d(on) t r t d(off) t f turn-on delay time rise time turn-off delay time fall time v dd = 27.5 v, i d = 60 a r g =4.7 ? v gs = 10 v (see figure 2, figure 7) - tbd tbd tbd tbd - ns ns ns ns q g q gs q gd total gate charge gate-source charge gate-drain charge v dd = 30 v, i d = 120 a, v gs = 10 v, (see figure 3 ) - 100 30 26 - nc nc nc
STB200N6F3, sti200n6f3, stp200n6f3 electrical characteristics doc id 15606 rev 1 5/13 table 6. source drain diode symbol parameter test conditions min. typ. max. unit i sd i sdm (1) 1. pulse width limited by safe operating area source-drain current source-drain current (pulsed) - 120 480 a a v sd (2) 2. pulsed: pulse duration = 300s, duty cycle 1.5% forward on voltage i sd =120 a, v gs =0 - 1.5 v t rr q rr i rrm reverse recovery time reverse recovery charge reverse recovery current i sd =120 a, di/dt = 100 a/s, v dd =35 v, tj=150 c (see figure 4 ) - tbd tbd tbd ns c a
test circuits STB200N6F3, sti200n6f3, stp200n6f3 6/13 doc id 15606 rev 1 3 test circuits figure 2. switching times test circuit for resistive load figure 3. gate charge test circuit figure 4. test circuit for inductive load switching and diode recovery times figure 5. unclamped inductive load test circuit figure 6. unclamped inductive waveform figure 7. switching time waveform
STB200N6F3, sti200n6f3, stp200n6f3 package mechanical data doc id 15606 rev 1 7/13 4 package mechanical data in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com. ecopack is an st trademark.
package mechanical data STB200N6F3, sti200n6f3, stp200n6f3 8/13 doc id 15606 rev 1 to-247 mechanical data 1 dim. mm. inch min. typ. max. min. typ. max. a 4.4 4.6 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.7 0.93 0.027 0.036 b2 1.14 1.7 0.044 0.067 c 0.45 0.6 0.017 0.023 c2 1.23 1.36 0.048 0.053 d 8.95 9.35 0.352 0.368 d1 8 0.315 e 10 10.4 0.393 e1 8.5 0.334 g 4.88 5.28 0.192 0.208 l 15 15.85 0.590 0.625 l2 1.27 1.4 0.050 0.055 l3 1.4 1.75 0.055 0.068 m 2.4 3.2 0.094 0.126 r0.4 0.015 v2 0o 4o d 2 pak mechanical data 3
STB200N6F3, sti200n6f3, stp200n6f3 package mechanical data doc id 15606 rev 1 9/13 dim. mm. inch min. typ. max. min. typ. max. a 4.40 4.60 0.173 0.181 a1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.034 b1 1.14 1.70 0.044 0.066 c 0.49 0.70 0.019 0.027 c2 1.23 1.32 0.048 0.052 d 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 e 10 10.40 0.393 0.410 l 13 14 0.511 0.551 l1 3.50 3.93 0.137 0.154 l2 1.27 1.40 0.050 0.055 to-262 (i 2 pak) mechanical data
package mechanical data STB200N6F3, sti200n6f3, stp200n6f3 10/13 doc id 15606 rev 1 to-220 mechanical data dim mm inch min typ max min typ max a 4.40 4.60 0.17 3 0.1 8 1 b 0.61 0. 88 0.024 0.0 3 4 b 1 1.14 1.70 0.044 0.066 c0.4 9 0.70 0.01 9 0.027 d 15.25 15.75 0.6 0.62 d1 1.27 0.050 e 10 10.40 0. 393 0.40 9 e 2.40 2.70 0.0 9 4 0.106 e1 4. 9 5 5.15 0.1 9 4 0.202 f1.2 3 1. 3 2 0.04 8 0.051 h1 6.20 6.60 0.244 0.256 j1 2.40 2.72 0.0 9 4 0.107 l1 3 14 0.511 0.551 l1 3 .50 3 . 93 0.1 3 7 0.154 l20 16.40 0.645 l 3 02 8 . 9 0 1.1 3 7 ? p 3 .75 3 . 8 5 0.147 0.151 q2.65 2. 9 5 0.104 0.116
STB200N6F3, sti200n6f3, stp200n6f3 packaging mechanical data doc id 15606 rev 1 11/13 5 packaging mechanical data tape and reel shipment d 2 pak footprint * on sales type dim. mm inch min. max. min. max. a 330 12.992 b 1.5 0.059 c 12.8 13.2 0.504 0.520 d 20.2 0795 g 24.4 26.4 0.960 1.039 n 100 3.937 t 30.4 1.197 base qty bulk qty 1000 1000 reel mechanical data dim. mm inch min. max. min. max. a0 10.5 10.7 0.413 0.421 b0 15.7 15.9 0.618 0.626 d 1.5 1.6 0.059 0.063 d1 1.59 1.61 0.062 0.063 e 1.65 1.85 0.065 0.073 f 11.4 11.6 0.449 0.456 k0 4.8 5.0 0.189 0.197 p0 3.9 4.1 0.153 0.161 p1 11.9 12.1 0.468 0.476 p2 1.9 2.1 0.075 0.082 r 50 1.574 t 0.25 0.35 0.0098 0.0137 w 23.7 24.3 0.933 0.956 tape mechanical data
revision history STB200N6F3, sti200n6f3, stp200n6f3 12/13 doc id 15606 rev 1 6 revision history table 7. document revision history date revision changes 20-apr-2009 1 first version
STB200N6F3, sti200 n6f3, stp200n6f3 doc id 15606 rev 1 13/13 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in military , air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2009 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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